Relife TX3 BGA Tool
The professional precision tool Relife TX3 is specially designed for GSM service technicians and micro-electronics laboratories, offering millimetric control in delicate procedures of separating and extracting integrated components from motherboards. With geometry calibrated for micro-interventions, the tool is ideal for safely lifting BGA chips, processors (CPU), NAND/storage memories, and other integrated circuits, preventing the breaking of contact pads. The handle made from selected high-tenacity steel ensures superior resistance to wear, deformation, and high temperatures, while the fine, polished, and precisely finished tip slides easily under components without scratching circuits, solder mask, or the fine PCB traces.

Features:
– Applications: Lifting and detaching processors (CPU), storage memories (NAND/eMMC), power chips, and BGA circuits- PCB Protection: Fine polished and smooth working tip, designed to prevent scratching of traces and damage to pads- Handle Material: Selected high-quality steel, with high hardness and resistance to mechanical wear- Thermal and Mechanical Control: High level of tenacity, resistant to direct use near soldering irons or hot air jets- Target Users: Phone/laptop service technicians, GSM workshops, and specialists in micro-soldering and reballing