Sunshine SS-101F BGA Tool
The Sunshine SS-101F tool is specially designed for precise adhesive removal and cleaning of BGA chips during delicaterepairs on motherboards. The package includes a double ergonomic handle measuring 135 x 9 x 9 mm, non-slip and easy to handle due to its weight of only 47 grams,equipped with a double cross chuck that ensures an extremely firm blade fixation. The 3 included interchangeable blades are hand-polishedto an ultra-thin thickness of 0.4 mm, allowing you to remove resin, adhesive, or disassemble chips and the diewithout damaging fine traces or neighboring components.