Relife TK4 Replacement Blade for UV / OCA Adhesive Removal Tool
The Relife TK4 replacement blade is designed for UV/OCA adhesive removal tools and offers precision and versatility in electronic repairs and industrial work. It is ideal for adhesive removal, cutting, chip detachment, CPU delamination, motherboard processing or disassembling encapsulated ICs, covering all delicate repair or industrial cleaning scenarios.The sharp and durable tip allows cutting and scraping with minimal resistance, and the safe design provides precise force control, protecting sensitive components such as CPU chips and motherboards. The blade is optimized for flexible switching between different types of operations, reducing costs and working time.

Features:
– Multi-scene adaptability: adhesive removal, cutting, chip detachment, CPU delamination, motherboard processing, frame adhesive removal, encapsulated IC disassembly- Precise operation: differentiated blades for specific needs, efficient handling in complex conditions- Sharp and durable: high wear resistance and long-term sharpness retention- Safe and reliable: precise force control to avoid damage to sensitive components